Issued Patents 2020
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10867900 | Dummy metal with zigzagged edges | Hsien-Wei Chen, Chi-Hsi Wu, Chen-Hua Yu, Der-Chyang Yeh, Li-Han Hsu +1 more | 2020-12-15 |
| 10833030 | Semiconductor device and method of manufacture | Hsien-Wei Chen, Chen-Hua Yu, Tsung-Shu Lin, Wei-Cheng Wu | 2020-11-10 |
| 10818800 | Semiconductor structure and method for preparing the same | Tseng-Fu Lu, Jhen-Yu Tsai, Ching-Chia Huang, Wei-Ming Liao | 2020-10-27 |
| 10763212 | Semiconductor structure | Ching-Chia Huang, Chen-Lun Ting, Tseng-Fu Lu, Wei-Ming Liao | 2020-09-01 |
| 10714426 | Semiconductor package and method of forming the same | Li-Han Hsu, Wei-Cheng Wu, Hsien-Wei Chen, Der-Chyang Yeh, Chi-Hsi Wu +2 more | 2020-07-14 |
| 10700045 | Surface mount device/integrated passive device on package or device structure and methods of forming | Hsien-Wei Chen, Chi-Hsi Wu, Chen-Hua Yu, Der-Chyang Yeh, Wei-Cheng Wu | 2020-06-30 |
| 10665474 | 3D packages and methods for forming the same | Tzu-Wei Chiu, Hsien-Pin Hu, Kuo-Ching Hsu, Shang-Yun Hou, Shin-Puu Jeng | 2020-05-26 |
| 10629537 | Conductive vias in semiconductor packages and methods of forming same | Li-Han Hsu, Wei-Cheng Wu, Hsien-Wei Chen, Der-Chyang Yeh, Chi-Hsi Wu +1 more | 2020-04-21 |