Issued Patents 2020
Showing 1–25 of 44 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10879194 | Semiconductor device package and method of manufacturing the same | Li-Hui Cheng, Po-Hao Tsai, Jeh-Yin Chang, Li-Chung Kuo, Hsien-Ju Tsou +3 more | 2020-12-29 |
| 10872850 | Package structure and method of forming thereof | Li-Hui Cheng, Po-Hao Tsai | 2020-12-22 |
| 10867965 | Package structures and methods of forming the same | Ying-Ching Shih, Chi-Hsi Wu, Chen-Hua Yu, Chih-Wei Wu, Pu Wang +1 more | 2020-12-15 |
| 10867897 | PoP device | Chin-Chuan Chang, Nai-Wei Liu, Wan-Ting Shih | 2020-12-15 |
| 10861835 | Solution for reducing poor contact in InFO package | Chen-Hua Yu, Szu-Wei Lu, Shih-Ting Lin, Shin-Puu Jeng | 2020-12-08 |
| 10847443 | Front-to-back bonding with through-substrate via (TSV) | — | 2020-11-24 |
| 10847414 | Embedded 3D interposer structure | Ying-Ching Shih, Wen-Chih Chiou, Shin-Puu Jeng, Chen-Hua Yu | 2020-11-24 |
| 10840218 | Semiconductor device and method of manufacture | Chen-Hua Yu, Po-Hao Tsai | 2020-11-17 |
| 10840215 | Sawing underfill in packaging processes | Szu-Wei Lu, Ying-Da Wang, Li-Chung Kuo | 2020-11-17 |
| 10833039 | Multi-chip fan out package and methods of forming the same | Chen-Hua Yu, Jui-Pin Hung | 2020-11-10 |
| 10825693 | Carrier warpage control for three dimensional integrated circuit (3DIC) stacking | Shih-Ting Lin, Chen-Hua Yu | 2020-11-03 |
| 10818583 | Semiconductor devices, methods of manufacture thereof, and semiconductor device packages | I-Ting Chen, Ying-Ching Shih, Po-Hao Tsai, Szu-Wei Lu | 2020-10-27 |
| 10818607 | Semiconductor device and method of manufacture | Chen-Hua Yu, Po-Hao Tsai | 2020-10-27 |
| 10811298 | Patterned carrier wafers and methods of making and using the same | — | 2020-10-20 |
| 10804247 | Chip package structure with conductive shielding film | Chen-Hua Yu, An-Jhih Su, Po-Hao Tsai | 2020-10-13 |
| 10804187 | Fan-out wafer level package structure | — | 2020-10-13 |
| 10784123 | Integrated circuit packages and methods of forming same | Li-Hui Cheng, Po-Hao Tsai | 2020-09-22 |
| 10770365 | Package structures and methods of forming the same | Chen-Hua Yu, Hsien-Pin Hu, Szu-Wei Lu, Shang-Yun Hou, Wen-Hsin Wei +2 more | 2020-09-08 |
| 10763132 | Release film as isolation film in package | Li-Hui Cheng, Po-Hao Tsai | 2020-09-01 |
| 10748869 | Protective layer for contact pads in fan-out interconnect structure and method of forming same | Chin-Chuan Chang, Tsei-Chung Fu | 2020-08-18 |
| 10741511 | Fan-out package and methods of forming thereof | Wan-Ting Shih, Nai-Wei Liu, Cheng-Lin Huang | 2020-08-11 |
| 10741467 | Die-on-interposer assembly with dam structure and method of manufacturing the same | Chih-Wei Wu, Szu-Wei Lu | 2020-08-11 |
| 10741520 | Method of controlling bump height variation | Po-Hao Tsai | 2020-08-11 |
| 10720403 | Integrated fan-out package structures with recesses in molding compound | Po-Hao Tsai, Li-Hui Cheng, Jui-Pin Hung | 2020-07-21 |
| 10699981 | Non-vertical through-via in package | Cheng-Lin Huang, Jung-Hua Chang, Jy-Jie Gau | 2020-06-30 |