Issued Patents 2020
Showing 1–14 of 14 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10879194 | Semiconductor device package and method of manufacturing the same | Jing-Cheng Lin, Po-Hao Tsai, Jeh-Yin Chang, Li-Chung Kuo, Hsien-Ju Tsou +3 more | 2020-12-29 |
| 10872850 | Package structure and method of forming thereof | Po-Hao Tsai, Jing-Cheng Lin | 2020-12-22 |
| 10867955 | Package structure having adhesive layer surrounded dam structure | Chin-Fu Kao, Chih-Yuan Chien, Szu-Wei Lu | 2020-12-15 |
| 10867849 | Package-on-package structure | Chin-Fu Kao, Chih-Yuan Chien, Szu-Wei Lu | 2020-12-15 |
| 10852476 | Semiconductor package, integrated optical communication system and manufacturing method of integrated optical communication system | Chih-Hao Chen, Chin-Fu Kao, Szu-Wei Lu | 2020-12-01 |
| 10796976 | Semiconductor device and method of forming the same | Chih-Chien Pan, Chin-Fu Kao, Szu-Wei Lu | 2020-10-06 |
| 10784123 | Integrated circuit packages and methods of forming same | Jing-Cheng Lin, Po-Hao Tsai | 2020-09-22 |
| 10763132 | Release film as isolation film in package | Jing-Cheng Lin, Po-Hao Tsai | 2020-09-01 |
| 10720403 | Integrated fan-out package structures with recesses in molding compound | Po-Hao Tsai, Jui-Pin Hung, Jing-Cheng Lin | 2020-07-21 |
| 10679915 | Package structure and manufacturing method thereof | Ping-Yin Hsieh, Chin-Fu Kao, Szu-Wei Lu | 2020-06-09 |
| 10672752 | Semiconductor package and manufacturing method thereof | Jing-Cheng Lin, Po-Hao Tsai | 2020-06-02 |
| 10553569 | Multi-die structure and method for forming same | Chen-Hua Yu, Po-Hao Tsai, Jing-Cheng Lin | 2020-02-04 |
| 10535591 | Semiconductor device and method of manufacturing the same | Jing-Cheng Lin, Po-Hao Tsai | 2020-01-14 |
| 10535627 | Printing module, printing method and system of forming a printed structure | Jing-Cheng Lin, Po-Hao Tsai, Chih-Chien Pan | 2020-01-14 |