Issued Patents 2020
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10879194 | Semiconductor device package and method of manufacturing the same | Jing-Cheng Lin, Li-Hui Cheng, Po-Hao Tsai, Jeh-Yin Chang, Hsien-Ju Tsou +3 more | 2020-12-29 |
| 10861799 | Dummy die placement without backside chipping | Chih-Wei Wu, Pu Wang, Ying-Ching Shih, Szu-Wei Lu, Kung-Chen Yeh | 2020-12-08 |
| 10840215 | Sawing underfill in packaging processes | Szu-Wei Lu, Ying-Da Wang, Jing-Cheng Lin | 2020-11-17 |