Issued Patents 2020
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10867965 | Package structures and methods of forming the same | Ying-Ching Shih, Chi-Hsi Wu, Chen-Hua Yu, Chih-Wei Wu, Jing-Cheng Lin +1 more | 2020-12-15 |
| 10866124 | Systems and methods for speed estimation of contactless encoder systems | Philip Orlik, Kota Sadamoto, Wataru Tsujita | 2020-12-15 |
| 10861799 | Dummy die placement without backside chipping | Chih-Wei Wu, Li-Chung Kuo, Ying-Ching Shih, Szu-Wei Lu, Kung-Chen Yeh | 2020-12-08 |
| 10809400 | Determining shear slowness based on a higher order formation flexural acoustic mode | Sandip Bose, Bikash K. Sinha | 2020-10-20 |
| 10795151 | Methods and systems for terahertz-based positioning | Haoyu Fu, Philip Orlik, Toshiaki Koike-Akino, Rui Ma, Bingnan Wang | 2020-10-06 |
| 10783163 | Instance-based distributed data recovery method and apparatus | Chunbo Lai, Yingfei Xue, Bo Zhao | 2020-09-22 |
| 10606806 | Method and apparatus for storing time series data | Yingfei Xue, Chunbo Lai, Bo Zhao, Feng Zheng | 2020-03-31 |
| 10586763 | Semiconductor device and method of manufacture | Hsien-Ju Tsou, Chih-Wei Wu, Jing-Cheng Lin, Szu-Wei Lu, Ying-Ching Shih | 2020-03-10 |
| 10541839 | System and method for angular-domain channel estimation of massive MIMO system with low-resolution ADC with time-varying thresholds | Milutin Pajovic, Philip Orlik, Petros Boufounos | 2020-01-21 |
| 10535639 | Semiconductor device and manufacturing method of the same | Jing-Cheng Lin, Ying-Ching Shih, Chen-Hua Yu | 2020-01-14 |
| 10529690 | Package structures and methods of forming the same | Ying-Ching Shih, Chi-Hsi Wu, Chen-Hua Yu, Chih-Wei Wu, Jing-Cheng Lin +1 more | 2020-01-07 |