Issued Patents 2020
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10872862 | Package structure having bridge structure for connection between semiconductor dies and method of fabricating the same | Ying-Ching Shih | 2020-12-22 |
| 10867965 | Package structures and methods of forming the same | Ying-Ching Shih, Chi-Hsi Wu, Chen-Hua Yu, Jing-Cheng Lin, Pu Wang +1 more | 2020-12-15 |
| 10867962 | Packaging process and manufacturing method | Jiun-Ting Chen, Szu-Wei Lu, Ying-Ching Shih | 2020-12-15 |
| 10861799 | Dummy die placement without backside chipping | Li-Chung Kuo, Pu Wang, Ying-Ching Shih, Szu-Wei Lu, Kung-Chen Yeh | 2020-12-08 |
| 10804178 | Integrated circuit package and method of forming same | Chen-Hua Yu, Ying-Ching Shih, Szu-Wei Lu | 2020-10-13 |
| 10756058 | Semiconductor package and manufacturing method thereof | Ying-Ching Shih, Szu-Wei Lu | 2020-08-25 |
| 10741467 | Die-on-interposer assembly with dam structure and method of manufacturing the same | Szu-Wei Lu, Jing-Cheng Lin | 2020-08-11 |
| 10586763 | Semiconductor device and method of manufacture | Hsien-Ju Tsou, Jing-Cheng Lin, Pu Wang, Szu-Wei Lu, Ying-Ching Shih | 2020-03-10 |
| 10529637 | Integrated circuit package and method of forming same | Chen-Hua Yu, Ying-Ching Shih, Szu-Wei Lu | 2020-01-07 |
| D872040 | Super thin two-screen display | — | 2020-01-07 |
| 10529690 | Package structures and methods of forming the same | Ying-Ching Shih, Chi-Hsi Wu, Chen-Hua Yu, Jing-Cheng Lin, Pu Wang +1 more | 2020-01-07 |