Issued Patents 2020
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10867955 | Package structure having adhesive layer surrounded dam structure | Li-Hui Cheng, Chih-Yuan Chien, Szu-Wei Lu | 2020-12-15 |
| 10867849 | Package-on-package structure | Li-Hui Cheng, Chih-Yuan Chien, Szu-Wei Lu | 2020-12-15 |
| 10852476 | Semiconductor package, integrated optical communication system and manufacturing method of integrated optical communication system | Chih-Hao Chen, Li-Hui Cheng, Szu-Wei Lu | 2020-12-01 |
| 10796976 | Semiconductor device and method of forming the same | Chih-Chien Pan, Li-Hui Cheng, Szu-Wei Lu | 2020-10-06 |
| 10784222 | Metal-bump sidewall protection | Jung-Hua Chang, Jian-Yang He | 2020-09-22 |
| 10777531 | Package contact structure, semiconductor package and manufacturing method thereof | Jung-Hua Chang | 2020-09-15 |
| 10679915 | Package structure and manufacturing method thereof | Ping-Yin Hsieh, Li-Hui Cheng, Szu-Wei Lu | 2020-06-09 |