Issued Patents 2020
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10784222 | Metal-bump sidewall protection | Jian-Yang He, Chin-Fu Kao | 2020-09-22 |
| 10777531 | Package contact structure, semiconductor package and manufacturing method thereof | Chin-Fu Kao | 2020-09-15 |
| 10770427 | Chip package structure and method for forming the same | Ling Li, Cheng-Lin Huang | 2020-09-08 |
| 10699981 | Non-vertical through-via in package | Cheng-Lin Huang, Jy-Jie Gau, Jing-Cheng Lin | 2020-06-30 |