JG

Jy-Jie Gau

TSMC: 1 patents #1,818 of 3,471Top 55%
📍 Baoshan, TW: #149 of 427 inventorsTop 35%
Overall (2020): #399,759 of 565,922Top 75%
1
Patents 2020

Issued Patents 2020

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
10699981 Non-vertical through-via in package Cheng-Lin Huang, Jung-Hua Chang, Jing-Cheng Lin 2020-06-30