Issued Patents 2020
Showing 26–44 of 44 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10692764 | Alignment marks in substrate having through-substrate via (TSV) | Hsin Chang, Fang Wen Tsai, Wen-Chih Chiou, Shin-Puu Jeng | 2020-06-23 |
| 10672752 | Semiconductor package and manufacturing method thereof | Li-Hui Cheng, Po-Hao Tsai | 2020-06-02 |
| 10672723 | Semiconductor package | Chin-Chuan Chang, Jui-Pin Hung | 2020-06-02 |
| 10658195 | Metal oxide layered structure and methods of forming the same | Cheng-Lin Huang | 2020-05-19 |
| 10658347 | Semiconductor packages and methods of forming the same | Chen-Hua Yu, Po-Hao Tsai | 2020-05-19 |
| 10643836 | Bonded semiconductor structures | — | 2020-05-05 |
| 10636748 | Package structure | Chen-Hua Yu, Tsei-Chung Fu | 2020-04-28 |
| 10629547 | Redistribution-layer fanout package stiffener | — | 2020-04-21 |
| 10629477 | Raised via for terminal connections on different planes | Chen-Hua Yu, An-Jhih Su, Chi-Hsi Wu, Der-Chyang Yeh, Ming-Shih Yeh +1 more | 2020-04-21 |
| 10622297 | Semiconductor device and method | Chi-Hsi Wu, Chen-Hua Yu, Po-Hao Tsai | 2020-04-14 |
| 10586763 | Semiconductor device and method of manufacture | Hsien-Ju Tsou, Chih-Wei Wu, Pu Wang, Szu-Wei Lu, Ying-Ching Shih | 2020-03-10 |
| 10553569 | Multi-die structure and method for forming same | Chen-Hua Yu, Po-Hao Tsai, Li-Hui Cheng | 2020-02-04 |
| 10541213 | Backside redistribution layer (RDL) structure | Po-Hao Tsai | 2020-01-21 |
| 10535591 | Semiconductor device and method of manufacturing the same | Li-Hui Cheng, Po-Hao Tsai | 2020-01-14 |
| 10535639 | Semiconductor device and manufacturing method of the same | Ying-Ching Shih, Pu Wang, Chen-Hua Yu | 2020-01-14 |
| 10535627 | Printing module, printing method and system of forming a printed structure | Li-Hui Cheng, Po-Hao Tsai, Chih-Chien Pan | 2020-01-14 |
| 10535580 | Thermal dissipation through seal rings in 3DIC structure | Shih-Yi Syu | 2020-01-14 |
| 10529673 | Packaged semiconductor devices, methods of packaging semiconductor devices, and PoP devices | Po-Hao Tsai, Jui-Pin Hung | 2020-01-07 |
| 10529690 | Package structures and methods of forming the same | Ying-Ching Shih, Chi-Hsi Wu, Chen-Hua Yu, Chih-Wei Wu, Pu Wang +1 more | 2020-01-07 |