Issued Patents 2020
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10777510 | Semiconductor device including dummy via anchored to dummy metal layer | Jian-Hong Lin, Kuo-Yen Liu, Tzu-Li Lee, Yu-Ching Lee, Yih Wang | 2020-09-15 |
| 10692764 | Alignment marks in substrate having through-substrate via (TSV) | Fang Wen Tsai, Jing-Cheng Lin, Wen-Chih Chiou, Shin-Puu Jeng | 2020-06-23 |