Issued Patents 2020
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10692764 | Alignment marks in substrate having through-substrate via (TSV) | Hsin Chang, Jing-Cheng Lin, Wen-Chih Chiou, Shin-Puu Jeng | 2020-06-23 |
FT
Fang Wen Tsai
Overall (2020): #474,938 of 565,922Top 85%
1
Patents 2020