Issued Patents 2020
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10879224 | Package structure, die and method of manufacturing the same | Wei-Yu Chen, An-Jhih Su, Der-Chyang Yeh, Hua-Wei Tseng, Li-Hsien Huang | 2020-12-29 |
| 10872855 | Chip package and method of fabricating the same | Guan-Yu Chen, An-Jhih Su, Der-Chyang Yeh, Li-Hsien Huang | 2020-12-22 |
| 10867928 | Semiconductor device and manufacturing method thereof | Kuan-Chung Lu, An-Jhih Su, Der-Chyang Yeh, Li-Hsien Huang, Yueh-Ting Lin | 2020-12-15 |
| 10784207 | Multi-stacked package-on-package structures | Chen-Hua Yu, An-Jhih Su, Chi-Hsi Wu, Der-Chyang Yeh, Wei-Cheng Wu | 2020-09-22 |
| 10756037 | Package structure and fabricating method thereof | Li-Hsien Huang, An-Jhih Su, Der-Chyang Yeh, Hua-Wei Tseng, Yueh-Ting Lin | 2020-08-25 |
| 10636775 | Package structure and manufacturing method thereof | Wei-Yu Chen, An-Jhih Su, Chi-Hsi Wu, Der-Chyang Yeh, Li-Hsien Huang +2 more | 2020-04-28 |
| 10629477 | Raised via for terminal connections on different planes | Chen-Hua Yu, An-Jhih Su, Chi-Hsi Wu, Der-Chyang Yeh, Jing-Cheng Lin +1 more | 2020-04-21 |
| 10622302 | Via for semiconductor device connection and methods of forming the same | Chen-Hua Yu, An-Jhih Su, Chi-Hsi Wu, Wen-Chih Chiou, Tsang-Jiuh Wu +1 more | 2020-04-14 |
| 10529650 | Semiconductor package and method | Wei-Yu Chen, An-Jhih Su, Der-Chyang Yeh, Li-Hsien Huang | 2020-01-07 |