Issued Patents 2020
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10879224 | Package structure, die and method of manufacturing the same | Wei-Yu Chen, An-Jhih Su, Der-Chyang Yeh, Li-Hsien Huang, Ming-Shih Yeh | 2020-12-29 |
| 10756037 | Package structure and fabricating method thereof | Li-Hsien Huang, An-Jhih Su, Der-Chyang Yeh, Yueh-Ting Lin, Ming-Shih Yeh | 2020-08-25 |
| 10541226 | Package structure and method of forming the same | Chen-Hua Yu, Li-Hsien Huang, Chi-Hsi Wu, Der-Chyang Yeh, Hsien-Wei Chen +1 more | 2020-01-21 |