Issued Patents 2020
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10867963 | Die stack structure and method of fabricating the same | Chia-Hao Hsu, Chien-Ming Chiu, Yung-Chi Lin, Wen-Chih Chiou | 2020-12-15 |
| 10867943 | Die structure, die stack structure and method of fabricating the same | Yi-Hsiu Chen, Wen-Chih Chiou, Tung-Hsien Wu | 2020-12-15 |
| 10811374 | Interconnect structure and method of forming same | Hsiao Yun Lo, Lin-Chih Huang, Tasi-Jung Wu, Hsin-Yu Chen, Yung-Chi Lin +2 more | 2020-10-20 |
| 10784162 | Method of making a semiconductor component having through-silicon vias | Chen-Hua Yu, Cheng-Hung Chang, Ebin Liao, Chia-Lin Yu, Hsiang-Yi Wang +4 more | 2020-09-22 |
| 10714423 | Through via structure and method | Yung-Chi Lin, Hsin-Yu Chen, Lin-Chih Huang, Wen-Chih Chiou | 2020-07-14 |
| 10622302 | Via for semiconductor device connection and methods of forming the same | Chen-Hua Yu, An-Jhih Su, Chi-Hsi Wu, Wen-Chih Chiou, Der-Chyang Yeh +1 more | 2020-04-14 |
| 10566237 | Profile of through via protrusion in 3DIC interconnect | Jiung Wu, Kuan-Liang Lai, Ming-Tsu Chung, Hong-Ye Shih, Ku-Feng Yang +3 more | 2020-02-18 |
| 10535586 | Robust through-silicon-via structure | Yung-Chi Lin, Wen-Chih Chiou | 2020-01-14 |