Issued Patents 2020
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10784162 | Method of making a semiconductor component having through-silicon vias | Chen-Hua Yu, Ebin Liao, Chia-Lin Yu, Hsiang-Yi Wang, Chun Hua Chang +4 more | 2020-09-22 |
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Cheng-Hung Chang
Overall (2020): #521,245 of 565,922Top 95%
1
Patents 2020