Issued Patents 2020
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10784162 | Method of making a semiconductor component having through-silicon vias | Chen-Hua Yu, Cheng-Hung Chang, Ebin Liao, Chia-Lin Yu, Chun Hua Chang +4 more | 2020-09-22 |
HW
Hsiang-Yi Wang
Overall (2020): #445,038 of 565,922Top 80%
1
Patents 2020