Issued Patents 2020
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10872874 | Bonding apparatus and method of bonding substrates | Chen-Hua Yu, Wen-Chih Chiou | 2020-12-22 |
| 10867831 | Method and apparatus for bonding semiconductor devices | Yan-Zuo Tsai, Yang-Chih Hsueh, Chia-Yin Chen, Fu-Kang Tien, Wen-Chih Chiou | 2020-12-15 |
| 10784162 | Method of making a semiconductor component having through-silicon vias | Chen-Hua Yu, Cheng-Hung Chang, Chia-Lin Yu, Hsiang-Yi Wang, Chun Hua Chang +4 more | 2020-09-22 |
| 10748803 | Method and apparatus for bonding semiconductor devices | Yan-Zuo Tsai, Yang-Chih Hsueh, Chia-Yin Chen, Fu-Kang Tien, Wen-Chih Chiou | 2020-08-18 |
| 10727294 | Semiconductor devices, methods of manufacture thereof, and capacitors | Wen-Chih Chiou, Shin-Puu Jeng | 2020-07-28 |
| 10672737 | Three-dimensional integrated circuit structure and method of manufacturing the same | Yi-Hsiu Chen, Hong-Ye Shih, Wen-Chih Chiou, Jia-Ling Ko | 2020-06-02 |