Issued Patents 2020
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10867831 | Method and apparatus for bonding semiconductor devices | Yan-Zuo Tsai, Yang-Chih Hsueh, Chia-Yin Chen, Ebin Liao, Wen-Chih Chiou | 2020-12-15 |
| 10748803 | Method and apparatus for bonding semiconductor devices | Yan-Zuo Tsai, Yang-Chih Hsueh, Chia-Yin Chen, Ebin Liao, Wen-Chih Chiou | 2020-08-18 |