Issued Patents 2020
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10784162 | Method of making a semiconductor component having through-silicon vias | Chen-Hua Yu, Cheng-Hung Chang, Ebin Liao, Hsiang-Yi Wang, Chun Hua Chang +4 more | 2020-09-22 |
CY
Chia-Lin Yu
Overall (2020): #509,720 of 565,922Top 95%
1
Patents 2020