Issued Patents 2020
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10879214 | Die stack structure and method of fabricating the same | Wen-Chih Chiou, Yung-Lung Chen | 2020-12-29 |
| 10867943 | Die structure, die stack structure and method of fabricating the same | Tsang-Jiuh Wu, Wen-Chih Chiou, Tung-Hsien Wu | 2020-12-15 |
| 10672737 | Three-dimensional integrated circuit structure and method of manufacturing the same | Ebin Liao, Hong-Ye Shih, Wen-Chih Chiou, Jia-Ling Ko | 2020-06-02 |
| 10665582 | Method of manufacturing semiconductor package structure | Chen-Hua Yu, Ming-Fa Chen, Wen-Chih Chiou | 2020-05-26 |
| 10636842 | Resistive random access memory and method for forming the same | Chia-Wen Cheng, Po-Yen Hsu, Ping Wang, Ming-Che Lin, He-Hsuan Chao | 2020-04-28 |
| 10600732 | Semiconductor device and method for fabricating the same | Min-Shiang Hsu, Yu-Han Tsai, Chih-Sheng Chang | 2020-03-24 |
| 10593877 | Resistive random access memory | Frederick Chen, Ping Wang, Shao-Ching Liao, Po-Yen Hsu, Ting-Ying Shen +4 more | 2020-03-17 |