Issued Patents 2020
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10672737 | Three-dimensional integrated circuit structure and method of manufacturing the same | Yi-Hsiu Chen, Ebin Liao, Wen-Chih Chiou, Jia-Ling Ko | 2020-06-02 |
| 10566237 | Profile of through via protrusion in 3DIC interconnect | Jiung Wu, Kuan-Liang Lai, Ming-Tsu Chung, Ku-Feng Yang, Tsang-Jiuh Wu +3 more | 2020-02-18 |