Issued Patents 2020
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10566237 | Profile of through via protrusion in 3DIC interconnect | Jiung Wu, Kuan-Liang Lai, Hong-Ye Shih, Ku-Feng Yang, Tsang-Jiuh Wu +3 more | 2020-02-18 |
MC
Ming-Tsu Chung
Overall (2020): #348,775 of 565,922Top 65%
1
Patents 2020