Issued Patents 2020
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10566237 | Profile of through via protrusion in 3DIC interconnect | Kuan-Liang Lai, Ming-Tsu Chung, Hong-Ye Shih, Ku-Feng Yang, Tsang-Jiuh Wu +3 more | 2020-02-18 |
JW
Jiung Wu
Overall (2020): #418,737 of 565,922Top 75%
1
Patents 2020