Issued Patents 2020
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10867963 | Die stack structure and method of fabricating the same | Chia-Hao Hsu, Chien-Ming Chiu, Tsang-Jiuh Wu, Wen-Chih Chiou | 2020-12-15 |
| 10867985 | Method and structure of three-dimensional chip stacking | Chen-Hua Yu, Wen-Chih Chiou | 2020-12-15 |
| 10811374 | Interconnect structure and method of forming same | Hsiao Yun Lo, Lin-Chih Huang, Tasi-Jung Wu, Hsin-Yu Chen, Ku-Feng Yang +2 more | 2020-10-20 |
| 10714423 | Through via structure and method | Hsin-Yu Chen, Lin-Chih Huang, Tsang-Jiuh Wu, Wen-Chih Chiou | 2020-07-14 |
| 10535586 | Robust through-silicon-via structure | Tsang-Jiuh Wu, Wen-Chih Chiou | 2020-01-14 |