Issued Patents 2020
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10811374 | Interconnect structure and method of forming same | Hsiao Yun Lo, Tasi-Jung Wu, Hsin-Yu Chen, Yung-Chi Lin, Ku-Feng Yang +2 more | 2020-10-20 |
| 10714423 | Through via structure and method | Yung-Chi Lin, Hsin-Yu Chen, Tsang-Jiuh Wu, Wen-Chih Chiou | 2020-07-14 |