Issued Patents 2020
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10867954 | Interconnect chips | Kuo-Chiang Ting, Chi-Hsi Wu, Shang-Yun Hou, Tu-Hao Yu, Ting-Yu Yeh | 2020-12-15 |
| 10867963 | Die stack structure and method of fabricating the same | Chien-Ming Chiu, Yung-Chi Lin, Tsang-Jiuh Wu, Wen-Chih Chiou | 2020-12-15 |
| 10790795 | Zeroing structure applicable to adjustable diplexer | Jen-Ti Peng, Chien-Chih Lee, Cheng-Lung Wu, Tsung-Hsien Tsai, Chih Sheng Tsai | 2020-09-29 |
| 10782895 | Management method of metadata for preventing data loss and memory device using the same | Cheng-Kuang Hsieh | 2020-09-22 |
| 10720401 | Interconnect chips | Kuo-Chiang Ting, Chi-Hsi Wu, Shang-Yun Hou, Tu-Hao Yu, Ting-Yu Yeh | 2020-07-21 |
| 10717796 | Ethylene vinyl alcohol copolymer pellet, method for extrusion of the pellet and extrusion molded film produced thereby | Huan Chang, Weng Shing Lin, Chih Chieh Liang | 2020-07-21 |
| 10701824 | Bending module and folding display device | Kai-Cheng Chao, You-Yu Chen, Chia-Huang Chan | 2020-06-30 |
| 10684552 | Method to mitigate defect printability for ID pattern | Yen-Cheng Lu, Shinn-Sheng Yu, Chia-Chen Chen, Jeng-Horng Chen, Anthony Yen | 2020-06-16 |
| 10663871 | Reticle stage and method for using the same | Chia-Yu Lee, Tao Chen, Ching-Juinn Huang, Po-Chung Cheng | 2020-05-26 |