Issued Patents 2020
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10867897 | PoP device | Jing-Cheng Lin, Nai-Wei Liu, Wan-Ting Shih | 2020-12-15 |
| 10811394 | Devices employing thermal and mechanical enhanced layers and methods of forming same | Chen-Hua Yu, An-Jhih Su, Wei-Yu Chen, Ying-Ju Chen, Tsung-Shu Lin +5 more | 2020-10-20 |
| 10748869 | Protective layer for contact pads in fan-out interconnect structure and method of forming same | Tsei-Chung Fu, Jing-Cheng Lin | 2020-08-18 |
| 10672631 | Method and system for substrate thinning | Yi-Chao Mao, Szu-Wei Lu | 2020-06-02 |
| 10672723 | Semiconductor package | Jing-Cheng Lin, Jui-Pin Hung | 2020-06-02 |