Issued Patents 2020
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10748869 | Protective layer for contact pads in fan-out interconnect structure and method of forming same | Chin-Chuan Chang, Jing-Cheng Lin | 2020-08-18 |
| 10636748 | Package structure | Chen-Hua Yu, Jing-Cheng Lin | 2020-04-28 |