Issued Patents 2020
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10854567 | 3D packages and methods for forming the same | Shang-Yun Hou, Sao-Ling Chiu, Ping-Kang Huang, Wen-Chih Chiou, Shin-Puu Jeng +1 more | 2020-12-01 |
| 10770365 | Package structures and methods of forming the same | Chen-Hua Yu, Hsien-Pin Hu, Jing-Cheng Lin, Szu-Wei Lu, Shang-Yun Hou +2 more | 2020-09-08 |
| 10535633 | Chip package having die structures of different heights and method of forming same | Hsien-Pin Hu, Shang-Yun Hou | 2020-01-14 |
| 10529679 | 3D packages and methods for forming the same | Shang-Yun Hou, Sao-Ling Chiu, Ping-Kang Huang, Wen-Chih Chiou, Shin-Puu Jeng +1 more | 2020-01-07 |