Issued Patents 2020
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10854567 | 3D packages and methods for forming the same | Shang-Yun Hou, Ping-Kang Huang, Wen-Hsin Wei, Wen-Chih Chiou, Shin-Puu Jeng +1 more | 2020-12-01 |
| 10529679 | 3D packages and methods for forming the same | Shang-Yun Hou, Ping-Kang Huang, Wen-Hsin Wei, Wen-Chih Chiou, Shin-Puu Jeng +1 more | 2020-01-07 |