Issued Patents 2020
Showing 26–50 of 71 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10797001 | Three-dimensional integrated circuit structures | Jie Chen, Ying-Ju Chen | 2020-10-06 |
| 10797015 | Method of manufacturing 3DIC structure | Sung-Feng Yeh, Ming-Fa Chen | 2020-10-06 |
| 10796927 | Integrated circuit package pad and methods of forming | Chen-Hua Yu, Chi-Hsi Wu, Der-Chyang Yeh, An-Jhih Su, Wei-Yu Chen | 2020-10-06 |
| 10784247 | Process control for package formation | Ming-Fa Chen | 2020-09-22 |
| 10770366 | Integrated circuit packages and methods for forming the same | Chia-Wei Tu, Tsung-Fu Tsai, Wen-Hsiung Lu, Yian-Liang Kuo | 2020-09-08 |
| 10756010 | Semiconductor device packaging structure having through interposer vias and through substrate vias | Chen-Hua Yu, Sung-Feng Yeh, Ming-Fa Chen, Tzuan-Horng Liu | 2020-08-25 |
| 10756007 | Pad design for reliability enhancement in packages | Jie Chen | 2020-08-25 |
| 10741490 | Device and package structure | An-Jhih Su, Li-Hsien Huang | 2020-08-11 |
| 10741512 | Semiconductor package and method of forming the same | Chi-Hsi Wu, Der-Chyang Yeh, Jie Chen | 2020-08-11 |
| 10741506 | Seal ring for hybrid-bond | Chih-Chia Hu, Chun-Chiang Kuo, Sen-Bor Jan, Ming-Fa Chen | 2020-08-11 |
| 10734357 | Chip package structure with molding layer | Wei-Yu Chen, Li-Hsien Huang, An-Jhih Su | 2020-08-04 |
| 10732679 | Portable information handling system low height mono barrel hinge | Chin-Chung Wu, Chih-Ping Chang, Te-Sen Chin, An-Chung Hsieh, Jihun Yeom +1 more | 2020-08-04 |
| 10727211 | Package structure with dummy die | Li-Hsien Huang | 2020-07-28 |
| 10727082 | Semiconductor device and manufacturing method thereof | Shou-Zen Chang, Chun-Lin Lu, Kai-Chiang Wu, Ching-Feng Yang, Vincent Chen +3 more | 2020-07-28 |
| 10720409 | Semiconductor packages with thermal-electrical-mechanical chips and methods of forming the same | Chen-Hua Yu, Der-Chyang Yeh, Li-Hsien Huang, Yueh-Ting Lin, Wei-Yu Chen +1 more | 2020-07-21 |
| 10720385 | Semiconductor structure | Ying-Ju Chen | 2020-07-21 |
| 10714426 | Semiconductor package and method of forming the same | Cheng-Hsien Hsieh, Li-Han Hsu, Wei-Cheng Wu, Der-Chyang Yeh, Chi-Hsi Wu +2 more | 2020-07-14 |
| 10714442 | Interconnect structures and methods of forming same | Wen-Hsiung Lu, Hsuan-Ting Kuo, Tsung-Yuan Yu, Ming-Da Cheng, Chung-Shi Liu | 2020-07-14 |
| 10700040 | Discrete polymer in fan-out packages | Jie Chen | 2020-06-30 |
| 10700045 | Surface mount device/integrated passive device on package or device structure and methods of forming | Cheng-Hsien Hsieh, Chi-Hsi Wu, Chen-Hua Yu, Der-Chyang Yeh, Wei-Cheng Wu | 2020-06-30 |
| 10700026 | Package with UBM and methods of forming | Li-Hsien Huang | 2020-06-30 |
| 10685910 | Packages with Si-substrate-free interposer and method forming same | Chen-Hua Yu, Sung-Feng Yeh, Ming-Fa Chen | 2020-06-16 |
| 10685937 | Integrated circuit package having dummy structures and method of forming same | Ming-Fa Chen, Chen-Hua Yu | 2020-06-16 |
| 10685935 | Forming metal bonds with recesses | Ming-Fa Chen, Sung-Feng Yeh, Wen-Chih Chiou | 2020-06-16 |
| 10679953 | Integrated fan-out structure and method of forming | An-Jhih Su, Tsung-Shu Lin | 2020-06-09 |