Issued Patents 2020
Showing 51–71 of 71 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10672734 | Package structures and methods of forming the same | Li-Hsien Huang, An-Jhih Su | 2020-06-02 |
| 10672754 | Semiconductor component, package structure and manufacturing method thereof | Ming-Fa Chen, Sung-Feng Yeh, Chi-Hwang Tai | 2020-06-02 |
| 10672741 | Semiconductor packages with thermal-electrical-mechanical chips and methods of forming the same | Chen-Hua Yu, Der-Chyang Yeh, Li-Hsien Huang, Yueh-Ting Lin, Wei-Yu Chen +1 more | 2020-06-02 |
| 10672738 | Package structures and methods of forming | Chen-Hua Yu, Der-Chyang Yeh | 2020-06-02 |
| 10672674 | Method of forming semiconductor device package having testing pads on a topmost die | Chen-Hua Yu, Sung-Feng Yeh, Ming-Fa Chen, Hui Liu, Ching-Pin Yuan | 2020-06-02 |
| 10665572 | Semiconductor package and manufacturing method thereof | Jie Chen | 2020-05-26 |
| 10665540 | Redistribution layer structures for integrated circuit package | Jie Chen, Ying-Ju Chen, Der-Chyang Yeh, Chen-Hua Yu | 2020-05-26 |
| 10658290 | Plurality of different size metal layers for a pad structure | Ching-Jung Yang, Chia-Wei Tu | 2020-05-19 |
| 10658339 | Semiconductor device and method of manufacture | Ying-Ju Chen, An-Jhih Su, Jie Chen | 2020-05-19 |
| 10658337 | Packages and packaging methods for semiconductor devices, and packaged semiconductor devices | Chen-Hua Yu, Shin-Puu Jeng, Der-Chyang Yeh, An-Jhih Su | 2020-05-19 |
| 10658333 | Package structure and method of fabricating the same | Ming-Fa Chen, Sung-Feng Yeh | 2020-05-19 |
| 10651131 | Supporting InFO packages to reduce warpage | Jie Chen, Ying-Ju Chen | 2020-05-12 |
| 10643965 | Structure and method of forming a joint assembly | Ying-Ju Chen, An-Jhih Su, Der-Chyang Yeh, Chi-Hsi Wu, Chen-Hua Yu | 2020-05-05 |
| 10643864 | Fan-out structure and method of fabricating the same | Chen-Hua Yu, An-Jhih Su, Chi-Hsi Wu, Der-Chyang Yeh, Wei-Yu Chen | 2020-05-05 |
| 10629476 | Packages with through-vias having tapered ends | — | 2020-04-21 |
| 10629560 | Semiconductor structure | Jie Chen, Ying-Ju Chen | 2020-04-21 |
| 10629555 | Packaging devices and methods of manufacture thereof | Jie Chen | 2020-04-21 |
| 10629537 | Conductive vias in semiconductor packages and methods of forming same | Cheng-Hsien Hsieh, Li-Han Hsu, Wei-Cheng Wu, Der-Chyang Yeh, Chi-Hsi Wu +1 more | 2020-04-21 |
| 10546838 | Integrated circuit package assembly | — | 2020-01-28 |
| 10541226 | Package structure and method of forming the same | Chen-Hua Yu, Li-Hsien Huang, Chi-Hsi Wu, Der-Chyang Yeh, An-Jhih Su +1 more | 2020-01-21 |
| 10535537 | Packaged semiconductor devices and methods of packaging semiconductor devices | — | 2020-01-14 |