Issued Patents 2020
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10867975 | Interconnect structures, packaged semiconductor devices, and methods of packaging semiconductor devices | Yian-Liang Kuo, Yi Wang | 2020-12-15 |
| 10770366 | Integrated circuit packages and methods for forming the same | Hsien-Wei Chen, Tsung-Fu Tsai, Wen-Hsiung Lu, Yian-Liang Kuo | 2020-09-08 |
| 10658290 | Plurality of different size metal layers for a pad structure | Hsien-Wei Chen, Ching-Jung Yang | 2020-05-19 |
| 10622509 | Vertical type light emitting diode die and method for fabricating the same | Ya-Li Chen, Chi-Ming Wang, Cheng-Yu Chung, Hsiang-An FENG | 2020-04-14 |
| 10622510 | Vertical type light emitting diode die and method for fabricating the same | Ya-Li Chen, Chi-Ming Wang, Cheng-Yu Chung, Hsiang-An FENG | 2020-04-14 |