Issued Patents 2020
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10867975 | Interconnect structures, packaged semiconductor devices, and methods of packaging semiconductor devices | Chia-Wei Tu, Yi Wang | 2020-12-15 |
| 10770366 | Integrated circuit packages and methods for forming the same | Chia-Wei Tu, Hsien-Wei Chen, Tsung-Fu Tsai, Wen-Hsiung Lu | 2020-09-08 |