Issued Patents 2020
Showing 26–32 of 32 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10636775 | Package structure and manufacturing method thereof | Wei-Yu Chen, An-Jhih Su, Chi-Hsi Wu, Li-Hsien Huang, Po-Hao Tsai +2 more | 2020-04-28 |
| 10629537 | Conductive vias in semiconductor packages and methods of forming same | Cheng-Hsien Hsieh, Li-Han Hsu, Wei-Cheng Wu, Hsien-Wei Chen, Chi-Hsi Wu +1 more | 2020-04-21 |
| 10629477 | Raised via for terminal connections on different planes | Chen-Hua Yu, An-Jhih Su, Chi-Hsi Wu, Ming-Shih Yeh, Jing-Cheng Lin +1 more | 2020-04-21 |
| 10622302 | Via for semiconductor device connection and methods of forming the same | Chen-Hua Yu, An-Jhih Su, Chi-Hsi Wu, Wen-Chih Chiou, Tsang-Jiuh Wu +1 more | 2020-04-14 |
| 10541226 | Package structure and method of forming the same | Chen-Hua Yu, Li-Hsien Huang, Chi-Hsi Wu, Hsien-Wei Chen, An-Jhih Su +1 more | 2020-01-21 |
| 10529698 | Semiconductor packages and methods of forming same | Chen-Hua Yu, Han-Ping Pu | 2020-01-07 |
| 10529650 | Semiconductor package and method | Wei-Yu Chen, An-Jhih Su, Li-Hsien Huang, Ming-Shih Yeh | 2020-01-07 |