Issued Patents 2020
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10867976 | Semiconductor packages having dummy connectors and methods of forming same | Chen-Shien Chen, Hsiu-Jen Lin, Ming-Chih Yew, Ming-Da Cheng, Yu-Tse Su +2 more | 2020-12-15 |
| 10651111 | Method of forming conductive bumps for cooling device connection | You-Hua Chou, Chun-Jen Chen, Perre Kao | 2020-05-12 |
| 10573573 | Package and package-on-package structure having elliptical conductive columns | Sheng-Huan Chiu, Chun-Jen Chen, Chen-Shien Chen, Kuo-Chio Liu, Kuo-Hui Chang +2 more | 2020-02-25 |
| 10546845 | Package on package structure | Dong Shen, Chen-Shien Chen, Kuo-Chio Liu, Hsi-Kuei Cheng | 2020-01-28 |