Issued Patents 2020
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10867973 | Package structure and method of forming the same | Ching Fu Chang, Chih-Kang Han, Hsin-Chieh Huang | 2020-12-15 |
| 10692809 | Manufacturing method for semiconductor structure | Chih-Kang Han, Ching Fu Chang, Hsin-Chieh Huang | 2020-06-23 |
| 10573573 | Package and package-on-package structure having elliptical conductive columns | Sheng-Huan Chiu, Chun-Jen Chen, Chen-Shien Chen, Kuo-Chio Liu, Kuo-Hui Chang +2 more | 2020-02-25 |
| 10546845 | Package on package structure | Dong Shen, Chen-Shien Chen, Kuo-Chio Liu, Yi-Jen Lai | 2020-01-28 |
| 10529697 | Package structure and method of forming the same | Ching Fu Chang, Chih-Kang Han, Hsin-Chieh Huang | 2020-01-07 |