Issued Patents 2020
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10867973 | Package structure and method of forming the same | Hsi-Kuei Cheng, Ching Fu Chang, Hsin-Chieh Huang | 2020-12-15 |
| 10692809 | Manufacturing method for semiconductor structure | Hsi-Kuei Cheng, Ching Fu Chang, Hsin-Chieh Huang | 2020-06-23 |
| 10529697 | Package structure and method of forming the same | Hsi-Kuei Cheng, Ching Fu Chang, Hsin-Chieh Huang | 2020-01-07 |