Issued Patents 2020
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10879185 | Package structure with bump | Ming-Yen Chiu, Hsin-Chieh Huang | 2020-12-29 |
| 10867973 | Package structure and method of forming the same | Hsi-Kuei Cheng, Chih-Kang Han, Hsin-Chieh Huang | 2020-12-15 |
| 10790235 | Integrated fan-out package and method of fabricating the same | Ming-Yen Chiu, Hsin-Chieh Huang | 2020-09-29 |
| 10770402 | Integrated fan-out package | Ming-Yen Chiu, Hsin-Chieh Huang | 2020-09-08 |
| 10734299 | Package with tilted interface between device die and encapsulating material | Ming-Yen Chiu, Hsin-Chieh Huang | 2020-08-04 |
| 10692809 | Manufacturing method for semiconductor structure | Hsi-Kuei Cheng, Chih-Kang Han, Hsin-Chieh Huang | 2020-06-23 |
| 10529697 | Package structure and method of forming the same | Hsi-Kuei Cheng, Chih-Kang Han, Hsin-Chieh Huang | 2020-01-07 |