Issued Patents 2020
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10879185 | Package structure with bump | Ming-Yen Chiu, Ching Fu Chang | 2020-12-29 |
| 10867973 | Package structure and method of forming the same | Hsi-Kuei Cheng, Ching Fu Chang, Chih-Kang Han | 2020-12-15 |
| 10790235 | Integrated fan-out package and method of fabricating the same | Ming-Yen Chiu, Ching Fu Chang | 2020-09-29 |
| 10770402 | Integrated fan-out package | Ming-Yen Chiu, Ching Fu Chang | 2020-09-08 |
| 10734299 | Package with tilted interface between device die and encapsulating material | Ming-Yen Chiu, Ching Fu Chang | 2020-08-04 |
| 10727135 | FinFET with sloped surface at interface between isolation structures and manufacturing method thereof | Chih-Sheng Li, Chi-Wen Liu | 2020-07-28 |
| 10720460 | High dielectric constant dielectric layer forming method, image sensor device, and manufacturing method thereof | Tsung-Han Tsai, Horng-Huei Tseng, Chun-Hao Chou, Kuo-Cheng Lee, Yung-Lung Hsu +1 more | 2020-07-21 |
| 10692809 | Manufacturing method for semiconductor structure | Hsi-Kuei Cheng, Chih-Kang Han, Ching Fu Chang | 2020-06-23 |
| 10636824 | High dielectric constant dielectric layer forming method, image sensor device, and manufacturing method thereof | Tsung-Han Tsai, Horng-Huei Tseng, Chun-Hao Chou, Kuo-Cheng Lee, Yung-Lung Hsu +1 more | 2020-04-28 |
| 10529697 | Package structure and method of forming the same | Hsi-Kuei Cheng, Ching Fu Chang, Chih-Kang Han | 2020-01-07 |