Issued Patents 2020
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10651111 | Method of forming conductive bumps for cooling device connection | You-Hua Chou, Yi-Jen Lai, Chun-Jen Chen | 2020-05-12 |
PK
Perre Kao
Overall (2020): #317,461 of 565,922Top 60%
1
Patents 2020