AA

Ai-Tee Ang

TSMC: 3 patents #881 of 3,471Top 30%
📍 Baoshan, TW: #28 of 427 inventorsTop 7%
Overall (2020): #100,245 of 565,922Top 20%
3
Patents 2020

Issued Patents 2020

Showing 1–3 of 3 patents

Patent #TitleCo-InventorsDate
10867953 Manufacturing method of integrated fan-out package Shing-Chao Chen, Ching-Hua Hsieh, Chih-Wei Lin, Ching-Yao Lin 2020-12-15
10734263 Semiconductor processing boat design with pressure sensor Hsiu-Jen Lin, Wei-Hung Lin, Ming-Da Cheng, Chung-Shi Liu 2020-08-04
10622240 Package on-package structure Chih-Wei Lin, Hui-Min Huang, Yu-Peng Tsai, Ming-Da Cheng, Chung-Shi Liu 2020-04-14