Issued Patents 2020
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10867953 | Manufacturing method of integrated fan-out package | Ai-Tee Ang, Shing-Chao Chen, Ching-Hua Hsieh, Chih-Wei Lin | 2020-12-15 |
| 10797008 | Semiconductor package and manufacturing method thereof | Po-Yuan Teng, Hao-Yi Tsai, Tin-Hao Kuo, Teng-Yuan Lo, Chih-Yu Wang | 2020-10-06 |
| 10734328 | Semiconductor package and manufacturing method thereof | Po-Yuan Teng, Hao-Yi Tsai, Tin-Hao Kuo, Teng-Yuan Lo, Chih-Lin Wang | 2020-08-04 |