Issued Patents 2020
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10797008 | Semiconductor package and manufacturing method thereof | Hao-Yi Tsai, Tin-Hao Kuo, Ching-Yao Lin, Teng-Yuan Lo, Chih-Yu Wang | 2020-10-06 |
| 10734328 | Semiconductor package and manufacturing method thereof | Hao-Yi Tsai, Tin-Hao Kuo, Ching-Yao Lin, Teng-Yuan Lo, Chih-Lin Wang | 2020-08-04 |