Issued Patents 2020
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10867911 | InFO coil structure and methods of manufacturing same | Chen-Hua Yu, Tsung-Hsien Chiang, Hao-Yi Tsai, Ming Hung Tseng | 2020-12-15 |
| 10847505 | Multi-chip semiconductor package | Yu-Chia Lai, Kuo Lung Pan, Tin-Hao Kuo, Hao-Yi Tsai, Chung-Shi Liu +1 more | 2020-11-24 |
| 10847304 | InFO coil on metal plate with slot | Chuei-Tang Wang, Wei-Ting Chen, Chieh-Yen Chen, Hao-Yi Tsai, Ming Hung Tseng +1 more | 2020-11-24 |
| 10825602 | Stacked coil for wireless charging structure on InFO package | Chen-Hua Yu, Tzu-Chun Tang, Chuei-Tang Wang, Hao-Yi Tsai, Ming Hung Tseng +1 more | 2020-11-03 |
| 10790244 | Semiconductor device and method | Tzu-Sung Huang, Chen-Hua Yu, Hao-Yi Tsai, Ming Hung Tseng | 2020-09-29 |
| 10763229 | Semiconductor structure | Vincent Chen, Chuei-Tang Wang, Hao-Yi Tsai, Chen-Hua Yu, Wei-Ting Chen +2 more | 2020-09-01 |
| 10720495 | Semiconductor device and manufacturing method thereof | Tsung-Yuan Yu, Hao-Yi Tsai, Chao-Wen Shih, Chia-Chun Miao | 2020-07-21 |
| 10720388 | Wireless charging package with chip integrated in coil center | Chen-Hua Yu, Chiang-Jui Chu, Chung-Shi Liu, Hao-Yi Tsai, Ming Hung Tseng | 2020-07-21 |
| 10651675 | Packaged semiconductor devices with wireless charging means | Chen-Hua Yu, Hao-Yi Tsai, Tzu-Sung Huang, Ming Hung Tseng | 2020-05-12 |
| 10530175 | Hexagonal semiconductor package structure | Tzu-Sung Huang, Chen-Hua Yu, Hao-Yi Tsai, Ming Hung Tseng | 2020-01-07 |