Issued Patents 2020
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10861823 | Dual-sided integrated fan-out package | Kuo Lung Pan, Tin-Hao Kuo, Hao-Yi Tsai, Chung-Shi Liu | 2020-12-08 |
| 10840111 | Chip package with fan-out structure | Shing-Chao Chen, Chih-Wei Lin, Meng-Tse Chen, Hui-Min Huang, Ming-Da Cheng +3 more | 2020-11-17 |
| 10643861 | Methods for making multi-die package with bridge layer | Yu-Feng Chen, Chen-Shien Chen, Mirng-Ji Lii | 2020-05-05 |