Issued Patents 2020
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10867810 | Substrate pad structure | Hao-Juin Liu, Yao-Chun Chuang, Ming Hung Tseng, Chen-Shien Chen | 2020-12-15 |
| 10861811 | Connector structure and method of forming same | Chen-Shien Chen, Sheng-Yu Wu, Mirng-Ji Lii | 2020-12-08 |
| 10784223 | Elongated bump structures in package structure | Yao-Chun Chuang, Chen-Shien Chen, Ming Hung Tseng | 2020-09-22 |
| 10748785 | Substrate pad structure | Hao-Juin Liu, Yao-Chun Chuang, Ming Hung Tseng, Chen-Shien Chen | 2020-08-18 |
| 10734347 | Dummy flip chip bumps for reducing stress | Sheng-Yu Wu, Tin-Hao Kuo, Chen-Shien Chen | 2020-08-04 |
| 10720788 | Wireless charging devices having wireless charging coils and methods of manufacture thereof | Chen-Hua Yu, Chen-Shien Chen, Ming Hung Tseng, Sen-Kuei Hsu, Yu-Feng Chen +1 more | 2020-07-21 |
| 10692848 | Stress reduction apparatus and method | Yao-Chun Chuang, Yu-Chen Hsu, Hao-Chun Liu, Chen-Cheng Kuo, Chen-Shien Chen | 2020-06-23 |