Issued Patents 2020
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10867810 | Substrate pad structure | Hao-Juin Liu, Chita Chuang, Ming Hung Tseng, Chen-Shien Chen | 2020-12-15 |
| 10784223 | Elongated bump structures in package structure | Chita Chuang, Chen-Shien Chen, Ming Hung Tseng | 2020-09-22 |
| 10748785 | Substrate pad structure | Hao-Juin Liu, Chita Chuang, Ming Hung Tseng, Chen-Shien Chen | 2020-08-18 |
| 10692848 | Stress reduction apparatus and method | Yu-Chen Hsu, Hao-Chun Liu, Chita Chuang, Chen-Cheng Kuo, Chen-Shien Chen | 2020-06-23 |