Issued Patents 2020
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10861811 | Connector structure and method of forming same | Chen-Shien Chen, Mirng-Ji Lii, Chita Chuang | 2020-12-08 |
| 10734347 | Dummy flip chip bumps for reducing stress | Tin-Hao Kuo, Chita Chuang, Chen-Shien Chen | 2020-08-04 |
| 10629509 | Redistribution circuit structures and methods of forming the same | Shang-Yun Tu, Ching-Wen Hsiao, Ching-Hui Chen | 2020-04-21 |